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Proceedings Paper

Real-time system for measuring three-dimensional shape of solder bump array by focus using varifocal mirror
Author(s): Akira Ishii; Haruka Tai; Jun Mitsudo
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Paper Abstract

This paper describes a real-time system for measuring the three-dimensional shape of solder bumps arrayed on an LSI chip-size-package (CSP) board presented for inspection based on the shape-from-focus technique. It uses a copper-alloy mirror deformed by a piezoelectric actuator as a varifocal mirror enabling a simple, fast, precise focusing mechanism without moving parts to be built. A practical measuring speed of 1.69 s/package for a small CSP board (4 x 4 mm2) was achieved by incorporating an exclusive field programmable gate array processor to calculate focus measure and by constructing a domed array of LEDs as a high-intensity, uniform illumination system so that a fast (150 fps) and high-resolution (1024 x 1024 pixels/frame) CMOS image sensor could be used. Accurate measurements of bump height were also achieved with errors of 10 μm (2σ) meeting the requirements for testing the coplanarity of a bump array.

Paper Details

Date Published: 10 October 2007
PDF: 8 pages
Proc. SPIE 6716, Optomechatronic Sensors and Instrumentation III, 671606 (10 October 2007); doi: 10.1117/12.754177
Show Author Affiliations
Akira Ishii, Ritsumeikan Univ. (Japan)
Haruka Tai, Ritsumeikan Univ. (Japan)
Jun Mitsudo, Canon Machinery Inc. (Japan)

Published in SPIE Proceedings Vol. 6716:
Optomechatronic Sensors and Instrumentation III
Rainer Tutsch; Hong Zhao; Katsuo Kurabayashi; Yasuhiro Takaya; Pavel Tománek, Editor(s)

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