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Proceedings Paper

A silicon wafer packaging solution for HB-LEDs
Author(s): Tom Murphy; Steen Weichel; Steven Isaacs; Jochen Kuhmann
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Paper Abstract

In this paper we present HyLED, a silicon wafer packaging solution for high-brightness LEDs. The associated technology is batch micro-machining/metallisation processing of silicon wafers allowing significant reduction of the final device size. The presented package is multi-functional where the micro-machined cavity acts as reflector, thermal conductor and reservoir for the silicone/colour conversion substance. The base material, silicon, has excellent mechanical and thermal properties and enables direct integration of intelligence. We present customer specific solutions, open tool samples and performance data for optical and thermal parameters and reliability testing. Thermal resistance values of R<5 K/W, junction-to-board are demonstrated.

Paper Details

Date Published: 26 September 2007
PDF: 8 pages
Proc. SPIE 6797, Manufacturing LEDs for Lighting and Displays, 67970F (26 September 2007); doi: 10.1117/12.753085
Show Author Affiliations
Tom Murphy, Hymite GmbH (Germany)
Steen Weichel, Hymite A/S (Denmark)
Steven Isaacs, Hymite A/S (Denmark)
Jochen Kuhmann, Hymite GmbH (Germany)


Published in SPIE Proceedings Vol. 6797:
Manufacturing LEDs for Lighting and Displays

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