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Proceedings Paper

Fast alignment of marks in COG bonding based on multi-resolution
Author(s): Hui Geng; Hanyu Hong; Yan Zhang; Zhimin Lin
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Paper Abstract

COG (chip on glass) bonding is widely used in LCD industry. The alignment of marks in COG bonding needs high precision and reliability. It is of utmost importance to find two marks in COG fast and exactly. Its key technique is to use the advanced optical system to get the two-marked positions of chip on the glass and to use the PLC procedure control to complete the automatic alignment A series of experiments are performed to test the algorithms proposed, which show that the fast alignment of marks in COG bonding based on multi-resolution is both rational and highly effective.

Paper Details

Date Published: 15 November 2007
PDF: 8 pages
Proc. SPIE 6786, MIPPR 2007: Automatic Target Recognition and Image Analysis; and Multispectral Image Acquisition, 67862K (15 November 2007); doi: 10.1117/12.751681
Show Author Affiliations
Hui Geng, Wuhan Institute of Technology (China)
Hanyu Hong, Wuhan Institute of Technology (China)
Yan Zhang, Wuhan Institute of Technology (China)
Zhimin Lin, Wuhan Institute of Technology (China)


Published in SPIE Proceedings Vol. 6786:
MIPPR 2007: Automatic Target Recognition and Image Analysis; and Multispectral Image Acquisition

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