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Proceedings Paper

Simultaneous defect inspection on the surface and in the interior of bare wafers using a simple knife-edge test
Author(s): Jun Ho Lee; Yongmin Kim; Jinseoub Kim; Yeong-eun Yoo
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Paper Abstract

This paper proposes a new, simple, high-speed wafer-inspection method using a knife-edge approach. This method basically corresponds to a bright-field microscope except the light reflected from the wafer surface is partially cut by a knife-edge, which increases edge contrast in the cutting direction. In addition, the knife-edge test does not depend on the light wavelength and thus the light can have any wavelength as far as it is reflected by the wafer surface. Therefore, the knife-edge test, which uses visible light, can be employed simultaneously with a looking through inspection technique, which uses infra-red, with a single white-light source. The knife-edge method in tandem with a looking through inspection is implemented at a laboratory level and preliminary experimental results demonstrating edge enhancement are presented.

Paper Details

Date Published: 28 November 2007
PDF: 5 pages
Proc. SPIE 6834, Optical Design and Testing III, 683417 (28 November 2007); doi: 10.1117/12.747730
Show Author Affiliations
Jun Ho Lee, Kongju National Univ. (South Korea)
Yongmin Kim, Mirae Technology (South Korea)
Jinseoub Kim, HanTech Co. Ltd. (South Korea)
Yeong-eun Yoo, Korea Institute of Machinery & Materials (South Korea)


Published in SPIE Proceedings Vol. 6834:
Optical Design and Testing III
Yongtian Wang; Theo T. Tschudi; Jannick P. Rolland; Kimio Tatsuno, Editor(s)

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