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Proceedings Paper

Pattern density and process related CD corrections at 32nm node
Author(s): Zdenek Benes; Jun Kotani
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Paper Abstract

With mask critical dimension (CD) uniformity requirements becoming tighter with each new technology node, mask manufacturing must deploy a wide range of corrections to meet the CD specifications. These corrections compensate for e-beam proximity effects, fogging effects, etch loading effect, and other global process non-idealities. In this paper, we present data demonstrating that the current capability of universal e-beam dose corrections meets 32nm CD uniformity requirements in the presence of various systematic CD errors. Given that the resist process demonstrates enough latitude to accommodate the required dose variations, it is the stability and repeatability of the process itself that limits the ability to meet CD requirements. Substrates, resist coating, post-coat delay, develop variations, and etch stability all contribute to CD variations. Rather than simply focusing on reducing systematic errors, the process stability must be addressed.

Paper Details

Date Published: 1 November 2007
PDF: 6 pages
Proc. SPIE 6730, Photomask Technology 2007, 67304A (1 November 2007); doi: 10.1117/12.747599
Show Author Affiliations
Zdenek Benes, IBM Systems and Technology Group (United States)
Jun Kotani, Toppan Electronics Inc. (United States)

Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)

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