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Proceedings Paper

DPL performance analysis strategy with conventional workflow
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Paper Abstract

DPL (Double Patterning Lithography) has been in public as one of candidates for 45nm or 32nm HP since ITRS2006update disclosed. A lot of report of the performances and issues regarding to DPL were published. The current main concerns are evaluation of the infrastructures such as decomposition software, advanced photomasks, higher-NA exposure tool and leading-edge hard-mask process. If there is simpler procedure to evaluate DPL using a conventional environment without hard-mask process, the development of DPL will be accelerated. Here, the simple evaluation procedure for DPL using actual photomasks combining double exposure technique was proposed. The pseudo DPL result in terms of mask CD uniformity, image placement and overlay were demonstrated. In this evaluation procedure, decomposition restriction, mask latitude and fabrication load were also discussed

Paper Details

Date Published: 30 October 2007
PDF: 10 pages
Proc. SPIE 6730, Photomask Technology 2007, 67301I (30 October 2007); doi: 10.1117/12.747380
Show Author Affiliations
Nobuhito Toyama, Dai Nippon Printing Co., Ltd. (Japan)
Yuichi Inazuki, Dai Nippon Printing Co., Ltd. (Japan)
Takanori Sutou, Dai Nippon Printing Co., Ltd. (Japan)
Takaharu Nagai, Dai Nippon Printing Co., Ltd. (Japan)
Yasutaka Morikawa, Dai Nippon Printing Co., Ltd. (Japan)
Hiroshi Mohri, Dai Nippon Printing Co., Ltd. (Japan)
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)
Junji Miyazaki, ASML Japan (Japan)
Alek Chen, ASML Taiwan (Taiwan)
Nandasiri Samarakone, ASML USA (United States)


Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)

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