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Proceedings Paper

Sensitivity comparison of fast integrated die-to-die T+R pattern inspection, standard database inspection, and STARlight2 contamination mode for application in mask production
Author(s): Heiko Schmalfuss; Thomas Schulmeyer; Jan Heumann; Michael Lang; Jean-Paul Sier
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Paper Abstract

'Fast Integrated Die-to-Die T+R' pattern inspection (DDTR), reflected tritone database inspection (DBRt) and STARlight2TM (SL2) contamination inspection are employed by mask makers in order to detect pattern defects and contamination defects on photomasks for in process inspection steps. In this paper we compare the detection capabilities of these modes on real production masks with a representative set of contamination and pattern defects. Currently, SL2 inspection is used to find contamination defects and die-to-die and die-to-database are used for pattern defects. In this paper we will show that the new introduced 'Fast Integrated Die-to-Die T+R' pattern inspection (DDTR)1 in combination with the DBRt can be used in production environment, instead of SL2 without any loss in the sensitivity. During the study, we collected and analyzed inspection data on critical layers such as lines & spaces and contact holes. Besides, performance of the modes on product plates characterization was done using a test mask with programmed defects.

Paper Details

Date Published: 16 November 2007
PDF: 11 pages
Proc. SPIE 6730, Photomask Technology 2007, 673025 (16 November 2007); doi: 10.1117/12.747164
Show Author Affiliations
Heiko Schmalfuss, KLA-Tencor Corp (United States)
Thomas Schulmeyer, Advanced Mask Technology Ctr. Inc. (Germany)
Jan Heumann, Advanced Mask Technology Ctr. Inc. (Germany)
Michael Lang, KLA-Tencor Corp. (United States)
Jean-Paul Sier, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)

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