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Proceedings Paper

Critical dimension control for 32 nm random contact hole array with resist reflow process
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Paper Abstract

50 nm random contact hole array by resist reflow process (RRP) was studied to make 32 nm node device. Patterning of smaller contact hole array is harder than patterning the line and space. RRP has a lot of advantages, but RRP strongly depends on pattern array, pitch, and shape. Thus, we must have full knowledge for pattern dependency after RRP, and then we need to have optimum optical proximity corrected mask including RRP to compensate the pattern dependency in random array. To make optimum optical proximity and RRP corrected mask, we must have better understanding that how much resist flows and where the contact hole locations are after RRP. A simulation is made to correctly predict RRP result by including the RRP parameters such as viscosity, adhesion force, surface tension and location of the contact hole. As a result, we made uniform 50 nm contact hole patterns even for the random contact hole array and for different shaped contact hole array by optical proximity corrected RRP.

Paper Details

Date Published: 1 November 2007
PDF: 11 pages
Proc. SPIE 6730, Photomask Technology 2007, 673043 (1 November 2007); doi: 10.1117/12.746518
Show Author Affiliations
Joon-Min Park, Hanyang Univ. (South Korea)
Young-Min Kang, Hanyang Univ. (South Korea)
Seung-Wook Park, Hanyang Univ. (South Korea)
Joo-Yoo Hong, Hanyang Univ. (South Korea)
Hye-Keun Oh, Hanyang Univ. (South Korea)

Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)

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