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Proceedings Paper

Shuttle fabrication for designs with lifted I/Os
Author(s): Rung-Bin Lin; Meng-Chiou Wu; Shih-Cheng Tsai
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Paper Abstract

The mask set for a shuttle run (multi-project wafer) may contain designs using different number of metal layers. Wafers fabricated with k metal layers can only yield dice for the designs using only k metal layers. This results in considerable waste of wafers. In this paper we propose a simple concept called Lifted-I/O (LIO) to address this problem. LIO elevates the I/Os of all designs to the highest metal layer possibly used in a shuttle run. Our study shows that a shuttle run with LIO for low-volume production is marginally better than that without LIO. However, the margin increases as production volume increases. For a production volume up to a few ten thousand dice per design, a shuttle run with LIO could pay up to 11% less, which corresponds to about 400 thousand dollars.

Paper Details

Date Published: 30 October 2007
PDF: 10 pages
Proc. SPIE 6730, Photomask Technology 2007, 67305C (30 October 2007); doi: 10.1117/12.743377
Show Author Affiliations
Rung-Bin Lin, Yuan Ze Univ. (Taiwan)
Meng-Chiou Wu, Yuan Ze Univ. (Taiwan)
Shih-Cheng Tsai, Yuan Ze Univ. (Taiwan)


Published in SPIE Proceedings Vol. 6730:
Photomask Technology 2007
Robert J. Naber; Hiroichi Kawahira, Editor(s)

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