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Proceedings Paper

Reliability study in the fabrication and packaging of optical devices
Author(s): H. P. Chan; M. A. Uddin
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Paper Abstract

There are two approaches to develop reliable photonic devices. One is by the process & materials optimization, and the other is the reliability assurance during the fabrication, packaging & operation period. These critical issues needed to be addressed in order to bring commercialization of these devices closer. The development of organic polymers with high optical quality & high performance has led to a maturing of the polymer photonic device field. The combination of structural flexibility and toughness in optical polymers also makes it more suitable for vertical integration to realize 3D and even for all-polymer integrated optics. Packages are usually an integral part of the device. Therefore, fabrication, packaging and reliability challenges are the well-known potential showstopper to the growth of photonic components. In this review, the suitability of optical polymer systems, the materials & process optimization issues in fabricating reliable planner lightwave circuit (PLC) devices, packaging of fiber array & splitter components to integrate fiber-to-waveguide devices for fiber-to-the-home (FTTH) networks are summarized.

Paper Details

Date Published: 21 November 2007
PDF: 9 pages
Proc. SPIE 6781, Passive Components and Fiber-based Devices IV, 67811N (21 November 2007); doi: 10.1117/12.743239
Show Author Affiliations
H. P. Chan, City Univ. of Hong Kong (Hong Kong China)
M. A. Uddin, City Univ. of Hong Kong (Hong Kong China)

Published in SPIE Proceedings Vol. 6781:
Passive Components and Fiber-based Devices IV
Ming-Jun Li; Jianping Chen; Satoki Kawanishi; Ian H. White, Editor(s)

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