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Proceedings Paper

Novel way of microreliefs fabrication for MEMS
Author(s): Yu. Timoshkov; A. Stognij; V. Timoshkov; V. Kurmashev
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Paper Abstract

The main goal of this work is low-cost technologies for precision microrelief production developed using common microelectronics materials and equipment. Three technologies of microrelief formation were worked out: polyimide, porous silicon, and porous alumina. Microreliefs were fabricated using nanocomposite materials instead of homogeneous metals, i.e. co-deposited metal matrix with inert ultra-fine particles by electroless or plating processes. Microreliefstructures were produced and tested in view of application for display and optical systems.

Paper Details

Date Published: 22 May 2007
PDF: 5 pages
Proc. SPIE 6637, XV International Symposium on Advanced Display Technologies, 66370K (22 May 2007); doi: 10.1117/12.742606
Show Author Affiliations
Yu. Timoshkov, Belarusian State Univ. of Informatics and Radioelectronics (Belarus)
A. Stognij, Belarusian State Univ. of Informatics and Radioelectronics (Belarus)
V. Timoshkov, Belarusian State Univ. of Informatics and Radioelectronics (Belarus)
V. Kurmashev, Belarusian State Univ. of Informatics and Radioelectronics (Belarus)


Published in SPIE Proceedings Vol. 6637:
XV International Symposium on Advanced Display Technologies

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