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Proceedings Paper

Back-illuminated three-dimensionally integrated CMOS image sensors for scientific applications
Author(s): Vyshnavi Suntharalingam; Dennis D. Rathman; Gregory Prigozhin; Steven Kissel; Mark Bautz
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Paper Abstract

SOI-based active pixel image sensors have been built in both monolithic and vertically interconnected pixel technologies. The latter easily supports the inclusion of more complex pixel circuitry without compromising pixel fill factor. A wafer-scale back-illumination process is used to achieve 100% fill factor photodiodes. Results from 256 x 256 and 1024 x 1024 pixel arrays are presented, with discussion of dark current improvement in the differing technologies.

Paper Details

Date Published: 17 September 2007
PDF: 10 pages
Proc. SPIE 6690, Focal Plane Arrays for Space Telescopes III, 669009 (17 September 2007); doi: 10.1117/12.739807
Show Author Affiliations
Vyshnavi Suntharalingam, Massachusetts Institute of Technology (United States)
Dennis D. Rathman, Massachusetts Institute of Technology (United States)
Gregory Prigozhin, Massachusetts Institute of Technology (United States)
Steven Kissel, Massachusetts Institute of Technology (United States)
Mark Bautz, Massachusetts Institute of Technology (United States)


Published in SPIE Proceedings Vol. 6690:
Focal Plane Arrays for Space Telescopes III
Thomas J. Grycewicz; Cheryl J. Marshall; Penny G. Warren, Editor(s)

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