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Proceedings Paper

Hydrogenated water application for particle removal on EUV mask blank substrates
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Paper Abstract

The capability of hydrogenated water to clean EUV blank substrates was examined. The hydrogenated water cleaning process was compared with an H2O2/NH4OH/H2O mixture (SC1) and ozonated water cleaning processes. A small amount ammonia added to the hydrogenated water improved the particle removal efficiency. The concentration of hydrogen and the method used to dispense the water had little effect. The use of ozonated and hydrogenated water together gave high particle removal efficiencies, which were similar to those obtained using SC1. Additionally, the use of ozonated water with hydrogenated water further reduced the amount ammonia required to achieve high particle removal efficiencies. With further process optimization hydrogenated and ozonated water has the potential to replace SC1 in cleaning EUV substrates.

Paper Details

Date Published: 3 May 2007
PDF: 4 pages
Proc. SPIE 6533, 23rd European Mask and Lithography Conference, 653311 (3 May 2007); doi: 10.1117/12.737174
Show Author Affiliations
Sean Eichenlaub, SEMATECH (United States)
Abbas Rastegar, SEMATECH (United States)
Peter Dress, HamaTech (Germany)
Fei Xu, HamaTech (Germany)
Pat Marmillion, SEMATECH (United States)
IBM (United States)


Published in SPIE Proceedings Vol. 6533:
23rd European Mask and Lithography Conference

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