Share Email Print

Proceedings Paper

Evaluation of an alternative UV-NIL mold fabrication process
Author(s): P. Voisin; T. Levender; M. Zelsmann; C. Gourgon; J. Boussey
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

UV curing Nanoimprint Lithography (UV-NIL) requires the use of UV-transparent molds presenting nanoscale features on their active face. Although the choice of the transparent material (0.25" thick fused silica) seems to be definitely adopted by the UV-NIL developers, several patterning approaches have been reported during the last years, still none of them has already reached a mass production level. In this paper, we report on alternative patterning techniques based on the use of a thin transparent films deposited on the fused silica thick template. We investigate the suitability of materials currently used in integrated circuits fabrication, i.e., silicon nitride, silicon and titanium nitrate. Patterning and transfer techniques of nanoscale features within the deposited thin films have been performed and characterized. The first molds obtained exhibit quite good specification at the range of 300 nm. Ongoing works aim to optimize these procedures and to evaluate their suitability for higher resolution range.

Paper Details

Date Published: 3 May 2007
PDF: 6 pages
Proc. SPIE 6533, 23rd European Mask and Lithography Conference, 65331G (3 May 2007); doi: 10.1117/12.736537
Show Author Affiliations
P. Voisin, ST Microelectronics (France)
CNRS/LTM – CEA (France)
CEA Leti – Minatec (France)
T. Levender, CEA Leti – Minatec (France)
M. Zelsmann, CNRS/LTM – CEA (France)
C. Gourgon, CNRS/LTM – CEA (France)
J. Boussey, CNRS/LTM – CEA (France)

Published in SPIE Proceedings Vol. 6533:
23rd European Mask and Lithography Conference
Uwe F. W. Behringer, Editor(s)

© SPIE. Terms of Use
Back to Top