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Proceedings Paper

Wavelength reconfigurable photonic switching using thermally tuned micro-ring resonators fabricated on silicon substrate
Author(s): Michael R. Wang; Han-Yong Ng; Daqun Li; Xuan Wang; Jose Martinez; Roberto R. Panepucci; Kachesh Pathak
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Paper Abstract

Micro-ring resonators have been traditionally fabricated using expensive III-V materials such as InP or GaAs. Device tuning is typically to utilize the electro-optic effect of the III-V materials that usually leads to complex device layer structures. As another tuning approach, thermo-optic tuning of micro-ring resonators is commonly achieved by heating up the whole chip. In general, it is more challenging to achieve highly localized heating on a common chip for independent tuning of multiple micro-ring resonators residing on the same substrate. To address these issues, we describe the development of wavelength reconfigurable photonic switching using thermally tuned micro-ring resonators fabricated on a low-cost silicon-on-insulator substrate. Independent tuning of multiple micro-ring resonators, spaced at 250 µm, is realized with highly localized micro heaters (50×50 μm2 per heater area) fabricated on the same silicon substrate. Owing to the large thermo-optic effect of silicon (Δn/ΔT=1.8×10-4 K-1), 8 mA heating current is sufficient to tune a micro-ring resonator with a 3-dB spectral line width of 0.1 nm by 2.5 nm while creating a minor peak shift of less than 0.04 nm for an adjacent resonator. The switching response time is about 1 ms. A 1×4 wavelength reconfigurable photonic switch device has been demonstrated. With a resonator diameter of approximately 10 μm (greater than 18 nm in free spectral range of each micro-ring resonator), larger port-count switch matrix with wavelength reconfiguration on a small device foot print is feasible for the development of large-scale integrated photonics.

Paper Details

Date Published: 11 September 2007
PDF: 7 pages
Proc. SPIE 6645, Nanoengineering: Fabrication, Properties, Optics, and Devices IV, 66450I (11 September 2007); doi: 10.1117/12.734799
Show Author Affiliations
Michael R. Wang, Univ. of Miami (United States)
Han-Yong Ng, Univ. of Miami (United States)
Daqun Li, New Span Opto-Technology, Inc. (United States)
Xuan Wang, Florida International Univ. (United States)
Jose Martinez, Florida International Univ. (United States)
Roberto R. Panepucci, Florida International Univ. (United States)
Kachesh Pathak, U.S. Army Space and Missile Defense Command (United States)


Published in SPIE Proceedings Vol. 6645:
Nanoengineering: Fabrication, Properties, Optics, and Devices IV
Elizabeth A. Dobisz; Louay A. Eldada, Editor(s)

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