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Proceedings Paper

A dual channel lens for simultaneous VIS and SWIR imaging in harsh radiation environments
Author(s): Sergiy Dets
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Paper Abstract

Rapid thermal annealing that utilizes broadband flash lamp sources requires optical diagnostics for instantaneous thermal mapping of silicon wafers and its in-situ monitoring during the process. A new split channel optical assembly offering simultaneous imaging via CMOS- and FPA-imager was designed. Reverse telephoto optical design allows distortion of <2.5% in both imaging paths over the field of view of ±18° with deep field range and no instrument protrusion into the semiconductor process chamber. Application of solarization resistant materials in a first negative group as well as a rugged housing suits the design to optically harsh environments. Additional stray light measures were taken to control heat dissipation inside the narrow lens barrel by the arrangement of refractive surfaces and absorptive baffles. The beam splitter in front of a second positive group is made of silicon, which both provides preliminary spectral filtering in the near infrared through-channel and further extends spectral capabilities of the visible (reflected) channel into UV-B region. Detailed lens performance, manufacturing aspects and other use of the lens - for direct discrimination of water-containing objects from the image pattern are reviewed.

Paper Details

Date Published: 14 September 2007
PDF: 10 pages
Proc. SPIE 6668, Novel Optical Systems Design and Optimization X, 66680L (14 September 2007); doi: 10.1117/12.734766
Show Author Affiliations
Sergiy Dets, Mattson Technology Canada (Canada)
resOptica Technologies (Canada)


Published in SPIE Proceedings Vol. 6668:
Novel Optical Systems Design and Optimization X
R. John Koshel; G. Groot Gregory, Editor(s)

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