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Proceedings Paper

High-speed form preserving polishing of precision aspheres
Author(s): Rainer Boerret; Andreas Kelm; Helge Thiess
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Paper Abstract

The two major process steps, grinding and polishing, of the classical process chain have to fulfill the following requirements: Grinding: low subsurface damage, no cutter marks and best shape accuracy Polishing: fast removal of subsurface damage by form preserving The goal for the polishing step is a flexible process capable of removing mm3/min by keeping the shape generated by the grinding process or improving the shape in parallel to the required specifications. To be fast a new polishing kinematics is applied. The improvement of the removal rate is in the order of 2-3 compared to a standard asphere polishing processes. The drawback is a huge spatial variation of the removal rate. By application of proper simulation procedures this shortcomings can be overcome, requiring a detailed understanding of the local removal rate. Furthermore an extensive set of analysis tools such as PSD based evaluation of 1 and 2D shape measurements and separation tools for grouping of surface errors are applied. They help to understand and optimize the local polishing action and to define the cut-off wavelength for the final correction step. Results of the simulation, evaluation and experimental results for 3 different kinds of aspheres will be presented to demonstrate the power of described approach.

Paper Details

Date Published: 14 September 2007
PDF: 11 pages
Proc. SPIE 6671, Optical Manufacturing and Testing VII, 667113 (14 September 2007); doi: 10.1117/12.733746
Show Author Affiliations
Rainer Boerret, Univ. of Applied Science Aalen (Germany)
Andreas Kelm, Univ. of Applied Science Aalen (Germany)
Helge Thiess, Carl Zeiss AG (Germany)


Published in SPIE Proceedings Vol. 6671:
Optical Manufacturing and Testing VII
James H. Burge; Oliver W. Faehnle; Ray Williamson, Editor(s)

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