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Proceedings Paper

Rapid fabrication of lightweight SiC aspheres using reactive atom plasma (RAP) processing
Author(s): Pradeep Subrahmanyan; George Gardopee; Yogesh Verma; Ning Li; Tom Yu; Thomas Kyler; Peter Fiske; Philip Sommer
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Paper Abstract

Polishing has traditionally been a process of mechanical abrasion with each iteration removing the damage from the previous iteration. Modern sub-aperture techniques such as CCOS, MRF polishing etc. have added a considerable amount of determinism to this iterative approach. However, such approaches suffer from one significant flaw, i.e., the algorithms are completely guided by figure error. This approach fails when there is a considerable amount of strain energy stored in the substrate and becomes very evident when the aspect ratio of the mirror increases significantly causing relaxation of strain energy to have deleterious and unpredictable effects on figure between iterations. This is particularly pronounced when the substrate is made of a hard ceramic such as silicon carbide requiring a considerable amount of pressure to obtain any appreciable material removal rate. This paper presents an alternate approach involving a stress-free figuring step and a buffing step intended to recover the surface roughness.

Paper Details

Date Published: 15 September 2007
PDF: 4 pages
Proc. SPIE 6666, Optical Materials and Structures Technologies III, 66660A (15 September 2007); doi: 10.1117/12.733123
Show Author Affiliations
Pradeep Subrahmanyan, RAPT Industries, Inc. (United States)
George Gardopee, RAPT Industries, Inc. (United States)
Yogesh Verma, RAPT Industries, Inc. (United States)
Ning Li, RAPT Industries, Inc. (United States)
Tom Yu, RAPT Industries, Inc. (United States)
Thomas Kyler, RAPT Industries, Inc. (United States)
Peter Fiske, RAPT Industries, Inc. (United States)
Philip Sommer, RAPT Industries, Inc. (United States)

Published in SPIE Proceedings Vol. 6666:
Optical Materials and Structures Technologies III
William A. Goodman; Joseph L. Robichaud, Editor(s)

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