Share Email Print
cover

Proceedings Paper

Athermal bonded mounts: incorporating aspect ratio into a closed-form solution
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Several approaches have been used to calculate a closed-form solution for the athermal bond thickness for mounting optical elements. All of the previously developed closed-form solutions use the assumption that the bondline is thin with respect to the width of the bond in the axial direction. While this assumption is mathematically convenient, it is not empirically or theoretically supported. To compensate for the inaccuracies of these closed-form solutions, recent research using test data and finite element analysis has centered on generating empirically determined correction factors that are applied to the closed-form solutions for a zero-stress bond. In this paper an alternative closed-form solution that incorporates the bond aspect ratio is presented. The values generated from this formula are compared to the empirical results of a finite element analysis (FEA) study. An example case is used to compare the results provided by the different methods for calculating the ideal bond thickness.

Paper Details

Date Published: 17 September 2007
PDF: 12 pages
Proc. SPIE 6665, New Developments in Optomechanics, 666503 (17 September 2007); doi: 10.1117/12.730275
Show Author Affiliations
Christopher L. Monti, Raytheon Missile Systems (United States)


Published in SPIE Proceedings Vol. 6665:
New Developments in Optomechanics
Alson E. Hatheway, Editor(s)

© SPIE. Terms of Use
Back to Top