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Proceedings Paper

Application of exposure simulation system to CD control investigation at 130-nm photolithography node
Author(s): Yu-Kuang Huang; Nien-Po Chen; Jason Chou; Judith Chang
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Paper Abstract

In the semiconductor process field, the control of the critical dimension (CD) is a major task, especially in the processes of mask manufacturing and wafer exposure. One of the difficult problems is that sometimes the linewidth variation on wafer is out of specification even though the linewidth on mask is in specification. The linewidth discrepancy may come from the process control during the chrome film etching, which will influence the sidewall profile of the chrome film pattern. The investigation begins with the analysis of the cross-section of the masks used in the 130-nm technology node regarding the angular variation of the profile. Through the simulation done with AIMS fab 248 exposure system, the optical energy distribution on the photoresist, affected by the sidewall angular variation of the mask, is analyzed with the intensity distribution across the simulated exposure images. The result enables us to establish the process window of the exposure latitude and the depth of the focus (DOF) for the acceptable linewidth variation (less than 4 nm.) The established process window can help the engineers to avoid the linewidth discrepancy between the wafer and the mask, even with the inevitable chrome sidewall angular variation of the mask.

Paper Details

Date Published: 15 May 2007
PDF: 9 pages
Proc. SPIE 6607, Photomask and Next-Generation Lithography Mask Technology XIV, 66072B (15 May 2007); doi: 10.1117/12.728994
Show Author Affiliations
Yu-Kuang Huang, Yuan Ze Univ. (Taiwan)
Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Nien-Po Chen, Yuan Ze Univ. (Taiwan)
Jason Chou, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Judith Chang, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)


Published in SPIE Proceedings Vol. 6607:
Photomask and Next-Generation Lithography Mask Technology XIV
Hidehiro Watanabe, Editor(s)

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