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Proceedings Paper

Field results from a new die-to-database reticle inspection platform
Author(s): William Broadbent; Ichiro Yokoyama; Paul Yu; Kazunori Seki; Ryohei Nomura; Heiko Schmalfuss; Jan Heumann; Jean-Paul Sier
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Paper Abstract

A new die-to-database high-resolution reticle defect inspection platform, TeraScanHR, has been developed for advanced production use with the 45nm logic node, and extendable for development use with the 32nm node (also the comparable memory nodes). These nodes will use predominantly ArF immersion lithography although EUV may also be used. According to recent surveys, the predominant reticle types for the 45nm node are 6% simple tri-tone and COG. Other advanced reticle types may also be used for these nodes including: dark field alternating, Mask Enhancer, complex tri-tone, high transmission, CPL, etc. Finally, aggressive model based OPC will typically be used which will include many small structures such as jogs, serifs, and SRAF (sub-resolution assist features) with accompanying very small gaps between adjacent structures. The current generation of inspection systems is inadequate to meet these requirements. The architecture and performance of the new TeraScanHR reticle inspection platform is described. This new platform is designed to inspect the aforementioned reticle types in die-to-database and die-to-die modes using both transmitted and reflected illumination. Recent results from field testing at two of the three beta sites are shown (Toppan Printing in Japan and the Advanced Mask Technology Center in Germany). The results include applicable programmed defect test reticles and advanced 45nm product reticles (also comparable memory reticles). The results show high sensitivity and low false detections being achieved. The platform can also be configured for the current 65nm, 90nm, and 130nm nodes.

Paper Details

Date Published: 14 May 2007
PDF: 14 pages
Proc. SPIE 6607, Photomask and Next-Generation Lithography Mask Technology XIV, 660714 (14 May 2007); doi: 10.1117/12.728953
Show Author Affiliations
William Broadbent, KLA-Tencor Corp. (United States)
Ichiro Yokoyama, KLA-Tencor Japan (Japan)
Paul Yu, KLA-Tencor Corp. (United States)
Kazunori Seki, Toppan Printing Co., Ltd. (Japan)
Ryohei Nomura, Toppan Printing Co., Ltd. (Japan)
Heiko Schmalfuss, KLA-Tencor Germany (Germany)
Jan Heumann, Advanced Mask Technology Center GmbH & Co. KG (Germany)
Jean-Paul Sier, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 6607:
Photomask and Next-Generation Lithography Mask Technology XIV
Hidehiro Watanabe, Editor(s)

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