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Proceedings Paper

Three-dimensional template fabrication process for the dual damascene NIL approach
Author(s): Joerg Butschke; Mathias Irmscher; Douglas Resnick; Holger Sailer; Ecron Thompson
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Paper Abstract

NIL technique enables an easy replication of three dimensional patterns. Combined with a UV printable low-k material the NIL lithography can dramatically simplify the dual damascene process. Goal of this work was to develop a template process scheme which enables the generation of high resolution pillars on top of corresponding lines for direct printing of later vias and metal lines. The process flow is based on conventional 6025 photomask blanks. Exposure was done on a variable shaped e-beam writer Vistec SB350 using a sample of an advanced negative tone CAR and Fujifilm pCAR FEP171 for the first and the second layer, respectively. Chrome and quartz etching was accomplished in an Oerlikon mask etcher Gen III and Gen IV. Assessment of the developed template process was done in terms of overlay accuracy, feature profile and resolution capability depending on aspect ratio and line duty cycle. Finally the printability of 3D templates fabricated according the developed process scheme was proved.

Paper Details

Date Published: 14 May 2007
PDF: 12 pages
Proc. SPIE 6607, Photomask and Next-Generation Lithography Mask Technology XIV, 66070U (14 May 2007); doi: 10.1117/12.728944
Show Author Affiliations
Joerg Butschke, IMS Chips (Germany)
Mathias Irmscher, IMS Chips (Germany)
Douglas Resnick, Molecular Imprints, Inc. (United States)
Holger Sailer, IMS Chips (Germany)
Ecron Thompson, Molecular Imprint, Inc. (United States)

Published in SPIE Proceedings Vol. 6607:
Photomask and Next-Generation Lithography Mask Technology XIV
Hidehiro Watanabe, Editor(s)

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