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Proceedings Paper

Dispersive white light interferometry for 3D inspection of thin film layers of flat panel displays
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Paper Abstract

Emerging possibility of applying white-light interferometry to the area of thin-film metrology is addressed. Emphasis is given to explaining underlying spectrally-resolved interferometric principles of white-light interferometry for measuring the top surface profile as well as the thickness of thin-film layers, which enables one to reconstruct the complete 3-D tomographical view of the target surface coated with thin-film layers. Actual measurement results demonstrate that white-light interferometry in either scanning or dispersive scheme is found well suited for high speed 3-D inspection of dielectric thin-film layers deposited on semiconductor or glass substrates.

Paper Details

Date Published: 18 June 2007
PDF: 8 pages
Proc. SPIE 6616, Optical Measurement Systems for Industrial Inspection V, 66160T (18 June 2007); doi: 10.1117/12.726040
Show Author Affiliations
Young-Sik Ghim, Korea Advanced Institute of Science and Technology (South Korea)
Joonho You, Korea Advanced Institute of Science and Technology (South Korea)
Seung-Woo Kim, Korea Advanced Institute of Science and Technology (South Korea)


Published in SPIE Proceedings Vol. 6616:
Optical Measurement Systems for Industrial Inspection V
Wolfgang Osten; Christophe Gorecki; Erik L. Novak, Editor(s)

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