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Proceedings Paper

Development of automated inspection system for highway surface distress
Author(s): Xiangshen Hou; Hua Wang; Qi Wang; Zheren Wang
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Paper Abstract

An automated system is developed and described for the inspection of the surface distress of highway pavements in this paper. The system comprises of four modules: artificial illumination module, image acquisition module, sync control module, data storage and analysis module. The system is capable of collecting and analyzing highway cracks with high-resolution digital images. The system can carry out crack surveys at a nominal speed of 72km/h with full coverage of pavement surface. Crack recognition is performed offline. The prototype has been tested in laboratory conditions and completed a survey of about 15,000km real road at normal running speed (72km/h).

Paper Details

Date Published: 5 March 2007
PDF: 4 pages
Proc. SPIE 6595, Fundamental Problems of Optoelectronics and Microelectronics III, 65951Y (5 March 2007); doi: 10.1117/12.725799
Show Author Affiliations
Xiangshen Hou, Harbin Institute of Technology (China)
Hua Wang, Harbin Institute of Technology (China)
Qi Wang, Harbin Institute of Technology (China)
Zheren Wang, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 6595:
Fundamental Problems of Optoelectronics and Microelectronics III

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