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Metal Rubber materials and devices for flexible circuits, ground planes and interconnects
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Paper Abstract

We report recent progress in the development of low modulus, highly electrically conducting thin film sheet and fabric materials and devices formed by molecular-level self-assembly processing methods and their use in flexible circuits.

Paper Details

Date Published: 11 May 2007
PDF: 6 pages
Proc. SPIE 6562, Unattended Ground, Sea, and Air Sensor Technologies and Applications IX, 65620I (11 May 2007); doi: 10.1117/12.724283
Show Author Affiliations
B. A. Davis, NanoSonic, Inc. (United States)
J. H. Lalli, NanoSonic, Inc. (United States)
A. Hill, NanoSonic, Inc. (United States)
R. O. Claus, NanoSonic, Inc. (United States)


Published in SPIE Proceedings Vol. 6562:
Unattended Ground, Sea, and Air Sensor Technologies and Applications IX
Edward M. Carapezza, Editor(s)

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