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Proceedings Paper

A new micromachined sensor system for tactile measurements of high-aspect ratio microstructures
Author(s): M. Balke; E. Peiner; L. Doering
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Paper Abstract

A new tactile sensor with piezoresistive read-out is presented. The sensor is designed for measurements of high aspect ratio structures with a resolution of some ten nanometer and a measuring range of hundreds of micrometer. Possible applications of the sensor are suggested. The silicon micromachining fabrication process is shown in detail next to the finite element simulations we performed. First measurements and a calibration process are described and the results are shown. The implementation into a measuring system is indicated.

Paper Details

Date Published: 15 May 2007
PDF: 10 pages
Proc. SPIE 6589, Smart Sensors, Actuators, and MEMS III, 65890J (15 May 2007); doi: 10.1117/12.724163
Show Author Affiliations
M. Balke, Technical Univ. Braunschweig (Germany)
E. Peiner, Technical Univ. Braunschweig (Germany)
L. Doering, Physikalisch-Technische Bundesanstalt (Germany)


Published in SPIE Proceedings Vol. 6589:
Smart Sensors, Actuators, and MEMS III
Thomas Becker; Carles Cané; N. Scott Barker, Editor(s)

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