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Proceedings Paper

Low temperature co-fired ceramics on optoelectronic sensors integration
Author(s): Ville Moilanen; Kari Kautio; Pentti Karioja; Raimo Rikola; Jarmo Lehtomaa; Jouko Malinen
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Paper Abstract

The optical analyzers used in on-line and off-line process measurements set a large variety of special demands for optical detectors, i.e. customized detectors are needed. Both the detector (array) and its read-out circuit are affected. The typical volume for process analyzers is so low that fully customized ASICs easily become too expensive for signal recovery solutions in optical detectors. This is due to high fixed costs in ASIC development. Low Temperature Co-fired Ceramics (LTCC) substrates allow high integration grade and the smart packaging solutions needed in optical detectors. The ceramic substrate is suitable for hermetic packaging. The high integration grade is possible thanks to multilayer capability, with narrow metal strips as well as blind and buried vias which can be placed directly underneath the solder pads. Standard connection methods can be used, i.e. soldering, gluing and wire bonding for components and detector chip assembly. By using small passive components and bare chip or chip scale packaged active components, one is able to integrate the read-out functions in a small enough space. This paper briefly presents three different cases where infrared photoconductive detector arrays are attached to read-out circuitry which is made on LTCC substrate. The detector read-out hybrids are packaged in hermetic metal packages. The packages have been either non-cooled or thermoelectrically cooled. 24 element PbS, 4 by 4 element PbS and 128 element MCT cases are handled. Also an example of an integrated infrared light emitting diode array for an LED-spectrometer is presented. General feasibility analysis, including some electrical test results and the management of substrate dimensional tolerances, is given.

Paper Details

Date Published: 16 May 2007
PDF: 12 pages
Proc. SPIE 6585, Optical Sensing Technology and Applications, 658506 (16 May 2007); doi: 10.1117/12.724158
Show Author Affiliations
Ville Moilanen, VTT (Finland)
Kari Kautio, VTT (Finland)
Pentti Karioja, VTT (Finland)
Raimo Rikola, Rikola Ltd. (Finland)
Jarmo Lehtomaa, Specim Ltd. (Finland)
Jouko Malinen, VTT (Finland)


Published in SPIE Proceedings Vol. 6585:
Optical Sensing Technology and Applications
Francesco Baldini; Jiri Homola; Robert A. Lieberman; Miroslav Miler, Editor(s)

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