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Proceedings Paper

Nanoscale relief on quartz: from phase masks to antireflection structures
Author(s): Vladimir N. Petryakov; Alexsander Y. Klimov; Boris Alexsandrovich Gribkov; Santiago M. Olaizola; Yury K. Verevkin
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Paper Abstract

Nanoscale periodic and quasiperiodic relieves on fused quartz are of interest for the creation of a variety of optical and electronic devices such as phase masks, one- and two-dimensional stamps for nanoimprint and wide-band antireflection structures. The authors of this paper have developed a method of interference lithography to pattern nanoscale relief on quartz with a high-power pulsed XeCl laser with high-quality output radiation at wavelength 308nm. One of the advantages of the proposed technique is the significantly smaller influence of mechanical oscillations in an optical setup on the results of nanoscale modification. The relief on quartz was formed with the use of a complete cycle of lithography. As the mask, a two-layer structure of a copper film of 50nm in thickness and a photoresist of 400nm in thickness were employed. The mask pattern was formed by exposure of a photoresist by two radiation beams of a XeCl laser with energy density ~ 30mJ/cm2, aqueous-alkali development of a photoresist, and copper etching by the ion beam (Ar+). Quartz was etched by the method of ion-beam reactive etching in a flow of CF4 - O2(20%) gas mixture, with etching rate 30nm/min.

Paper Details

Date Published: 12 June 2007
PDF: 7 pages
Proc. SPIE 6593, Photonic Materials, Devices, and Applications II, 65930H (12 June 2007); doi: 10.1117/12.723776
Show Author Affiliations
Vladimir N. Petryakov, Institute of Applied Physics (Russia)
Alexsander Y. Klimov, Institute of Applied Physics (Russia)
Boris Alexsandrovich Gribkov, Institute of Applied Physics (Russia)
Santiago M. Olaizola, CEIT and Tecnun, Univ. of Navarra (Spain)
Yury K. Verevkin, Institute of Applied Physics (Russia)

Published in SPIE Proceedings Vol. 6593:
Photonic Materials, Devices, and Applications II
Ali Serpengüzel; Gonçal Badenes; Giancarlo C. Righini, Editor(s)

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