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Proceedings Paper

Toward lower uncooled IR-FPA system integration cost
Author(s): Benoit Dupont; Michel Vilain
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Paper Abstract

This paper presents the recent progress at ULIS to reduce IR-FPA integration cost for camera manufacturers. The inherent wide offset and responsivity spread of classical uncooled infrared focal plane arrays, leads to complex compensation electronics, making camera integration far more complex and expensive. ULIS low dispersion a-Si:H focal plane arrays (FPAs) address already this issue by offering wide dynamic range, low NETD and low cost with no extra custom components. ULIS continues his effort towards even lower signal dispersion. Within this scope, this paper reviews the latest development at ULIS of low dispersion FPA integrated readout circuits and FPA-integrated tools enabling camera manufacturers to improve the image quality.

Paper Details

Date Published: 13 June 2007
PDF: 5 pages
Proc. SPIE 6542, Infrared Technology and Applications XXXIII, 65421S (13 June 2007); doi: 10.1117/12.723600
Show Author Affiliations
Benoit Dupont, ULIS (France)
Commissariat à l’Energie Atomique (France)
Univ. Paris Sud (France)
Michel Vilain, ULIS (France)


Published in SPIE Proceedings Vol. 6542:
Infrared Technology and Applications XXXIII
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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