Share Email Print

Proceedings Paper

Design automation techniques for high-resolution current folding and interpolating CMOS A/D converters
Author(s): D. Gevaert
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The design and testing of a 12-bit Analog-to-Digital (A/D) converter, in current mode, arranged in an 8-bit LSB and a 4- bit MSB architecture together with the integration of specialized test building blocks on chip allows the set up of a design automation technique for current folding and interpolation CMOS A/D converter architectures. The presented design methodology focuses on the automation for CMOS A/D building blocks in a flexible target current folding and interpolating architecture for a downscaling technology and for different quality specifications. The comprehensive understanding of all sources of mismatching in the crucial building blocks and the use of physical based mismatch modeling in the prediction of mismatch errors, more adequate and realistic sizing of all transistors will result in an overall area reduction of the A/D converter. In this design the folding degree is 16, the number of folders is 64 and the interpolation level is 4. The number of folders is reduced by creating intermediate folding signals with a 4-level interpolator based on current division techniques. Current comparators detect the zero-crossing between the differential folder output currents. The outputs of the comparators deliver a cyclic thermometer code. The digital synthesis part for decoding and error correction building blocks is a standardized digital standard cell design. The basic building blocks in the target architecture were designed in 0.35μ CMOS technology; they are suitable for topological reuse and are in an automated way downscaled into a 0.18μ CMOS technology.

Paper Details

Date Published: 10 May 2007
PDF: 10 pages
Proc. SPIE 6590, VLSI Circuits and Systems III, 65900S (10 May 2007); doi: 10.1117/12.721826
Show Author Affiliations
D. Gevaert, IMEC (Belgium)

Published in SPIE Proceedings Vol. 6590:
VLSI Circuits and Systems III
Valentín de Armas Sosa; Kamran Eshraghian; Félix B. Tobajas, Editor(s)

© SPIE. Terms of Use
Back to Top