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Proceedings Paper

Pitch polishing of silica: correlation between material removal rates and surface finishes
Author(s): B. Mullany; A. Landis; W. Williams; P. Murray; I. Roberts
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Paper Abstract

Nano-sized particles with well defined geometries and size distributions suitable for polishing glass and glass ceramics are readily available. Understanding how effective these particles are at removing material and smoothening surfaces during pitch polishing processes is essential for process optimization and achieving better surfaces. This paper details work conducted to measure how effective sub-micron sized particles are at polishing and to isolate the influence of process chemistry and slurry density on the material removal rate (MRR). The paper also details how modifying the slurry pH affects the polishing coefficient of friction (CoF). Fused silica was polished on a synthetic pitch polishing tool with a range of different polishing slurries. Slurries tested included 40nm diameter ceria based slurries with varying density and pH, and both 20nm and 750nm diameter ceria based slurries with fixed density and pH values. Findings include that a) the material removal rate decreases with particle size and decreasing slurry density, b) the surface finish is not strongly dependent on particle size, c) slurries with a pH of 7 are most effective in removing material, while slurries with a pH value of 4 have the lowest MRR, and finally that d) the polishing CoF is greatest at pH 4 and lowest at pH 10. The results indicate that while process chemistry is very influential when polishing with submicron sized particles, the actual nature of the interaction between the abrasive, the workpiece and the tool requires further investigation.

Paper Details

Date Published: 14 May 2007
PDF: 4 pages
Proc. SPIE 10316, Optifab 2007: Technical Digest, TD0420 (14 May 2007); doi: 10.1117/12.719782
Show Author Affiliations
B. Mullany, Univ. of North Carolina at Charlotte (United States)
A. Landis, Univ. of North Carolina at Charlotte (United States)
W. Williams, Univ. of North Carolina at Charlotte (United States)
P. Murray, Nanophase Technologies Corp. (United States)
I. Roberts, Nanophase Technologies Corp. (United States)


Published in SPIE Proceedings Vol. 10316:
Optifab 2007: Technical Digest
James J. Kumler; Matthias Pfaff, Editor(s)

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