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Proceedings Paper

Autonomous selection of PDE inpainting techniques vs. exemplar inpainting techniques for void fill of high resolution digital surface models
Author(s): Mark Rahmes; J. Harlan Yates; Josef DeVaughn Allen; Patrick Kelley
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Paper Abstract

High resolution Digital Surface Models (DSMs) may contain voids (missing data) due to the data collection process used to obtain the DSM, inclement weather conditions, low returns, system errors/malfunctions for various collection platforms, and other factors. DSM voids are also created during bare earth processing where culture and vegetation features have been extracted. The Harris LiteSiteTM Toolkit handles these void regions in DSMs via two novel techniques. We use both partial differential equations (PDEs) and exemplar based inpainting techniques to accurately fill voids. The PDE technique has its origin in fluid dynamics and heat equations (a particular subset of partial differential equations). The exemplar technique has its origin in texture analysis and image processing. Each technique is optimally suited for different input conditions. The PDE technique works better where the area to be void filled does not have disproportionately high frequency data in the neighborhood of the boundary of the void. Conversely, the exemplar based technique is better suited for high frequency areas. Both are autonomous with respect to detecting and repairing void regions. We describe a cohesive autonomous solution that dynamically selects the best technique as each void is being repaired.

Paper Details

Date Published: 10 May 2007
PDF: 10 pages
Proc. SPIE 6564, Modeling and Simulation for Military Operations II, 656405 (10 May 2007); doi: 10.1117/12.719448
Show Author Affiliations
Mark Rahmes, Harris Corp. (United States)
J. Harlan Yates, Harris Corp. (United States)
Josef DeVaughn Allen, Harris Corp. (United States)
Patrick Kelley, Harris Corp. (United States)


Published in SPIE Proceedings Vol. 6564:
Modeling and Simulation for Military Operations II
Kevin Schum; Dawn A. Trevisani, Editor(s)

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