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Proceedings Paper

Radiation sensitive developable bottom anti-reflective coatings (DBARC) for 193nm lithography: first generation
Author(s): Medhat Toukhy; Joseph Oberlander; Salem Mullen; PingHung Lu; Mark Neisser
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Paper Abstract

A first generation DBARC applicable for 1st minimum 193nm lithography is described in this paper. The polymer used in this DBARC is insoluble in the casting solvent of the resist, which is propyleneglycolmonomethyletheracetate (PGMEA). Photo acid generator (PAG) and base extractions from the DBARC coating by the resist casting solvent were examined by the DBARC dissolution rates in the developer, before and after solvent treatments. Although the resist and the DBARC do not appear to intermix, strong interaction between the two is evident by their lithographic performance and dissolution rate study.

Paper Details

Date Published: 23 March 2007
PDF: 8 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 651936 (23 March 2007); doi: 10.1117/12.717114
Show Author Affiliations
Medhat Toukhy, AZ Electronic Materials USA Corp. (United States)
Joseph Oberlander, AZ Electronic Materials USA Corp. (United States)
Salem Mullen, AZ Electronic Materials USA Corp. (United States)
PingHung Lu, AZ Electronic Materials USA Corp. (United States)
Mark Neisser, AZ Electronic Materials USA Corp. (United States)


Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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