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Proceedings Paper

Analysis of BGA defects by tomographic images
Author(s): T. Sumimoto; T. Maruyama; Y. Azuma; S. Goto; M. Mondou; N. Furukawa; S. Okada
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Paper Abstract

To improve the cost of performance in manufacturing IC packages, it is required to inspect BGA defects in the online process. The problems of image analysis for the detection of defects are the detection accuracy and image processing time according to a line speed of production. Using the X-ray penetration equipment, we have captured images of an IC package to search an abnormal BGA. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we tried to capture the tomographic images utilizing the latest imaging techniques.

Paper Details

Date Published: 24 October 2006
PDF: 5 pages
Proc. SPIE 6357, Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence, 63571N (24 October 2006); doi: 10.1117/12.716986
Show Author Affiliations
T. Sumimoto, Okayama Univ. Medical School (Japan)
T. Maruyama, Okayama Univ. Medical School (Japan)
Y. Azuma, Okayama Univ. Medical School (Japan)
S. Goto, Okayama Univ. Medical School (Japan)
M. Mondou, Eastern Hiroshima Prefecture Industrial Research Institute (Japan)
N. Furukawa, National Institute of Advanced Industrial Science and Technology (Japan)
S. Okada, National Institute of Advanced Industrial Science and Technology (Japan)


Published in SPIE Proceedings Vol. 6357:
Sixth International Symposium on Instrumentation and Control Technology: Signal Analysis, Measurement Theory, Photo-Electronic Technology, and Artificial Intelligence
Jiancheng Fang; Zhongyu Wang, Editor(s)

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