Share Email Print

Proceedings Paper

Numerical study on cold transfer characteristics of the space in a semiconductor refrigeration device
Author(s): Hui Zhang; Jun Wang; Kuang-Chao Fan
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper presented the variation law of temperature in three-dimensional space, which is cooled by the refrigeration provided by the cold side of a semiconductor. It's tested under the conditions of the natural and forced convection in a semiconductor refrigeration device under steady working conditions. The mathematical model of the temperature field of the semiconductor refrigeration device is described, and a numerical study on the temperature profile in a semiconductor refrigeration device was carried out using this model. Numerical simulation is applied to the present thermostated container. Then the space tempo direction in the case of the gas flows, distribution of pressure in each point, the data of three-dimensional temperature field, etc. are gained. The problems in present thermostated containers are discussed, the factor influencing current air organization and temperature field are analyzed. The experimental results show that forced convection is of benefit to the cold transfer and to the rise of refrigeration rate.

Paper Details

Date Published: 25 October 2006
PDF: 7 pages
Proc. SPIE 6280, Third International Symposium on Precision Mechanical Measurements, 62803Y (25 October 2006); doi: 10.1117/12.716369
Show Author Affiliations
Hui Zhang, Hefei Univ. of Technology (China)
Jun Wang, Hefei Univ. of Technology (China)
Kuang-Chao Fan, Hefei Univ. of Technology (China)
National Taiwan Univ. (China)

Published in SPIE Proceedings Vol. 6280:
Third International Symposium on Precision Mechanical Measurements
Kuang-Chao Fan; Wei Gao; Xiaofen Yu; Wenhao Huang; Penghao Hu, Editor(s)

© SPIE. Terms of Use
Back to Top