Share Email Print
cover

Proceedings Paper

Measurement of stresses in MEMS structures by stress release
Author(s): Dietmar Vogel; Neus Sabate; Astrid Gollhardt; Bernd Michel
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The paper presents a recently developed method of measuring frozen elastic stresses in micro components and devices. The approach bases on stress release at the component surface by focused ion beam (FIB) milling. Stresses are deduced from the experimentally determined deformation field around the FIB milling pattern, applying reasonable stress hypotheses and appropriate modeling of the stress release field. Because of the local nature of ion milling and the limited material volume affected by deformation, the method suites to very local stress measurement. Commonly, spatial resolution is achieved in a range from submicron to some tens of microns. Residual stresses in membrane type MEMS structures have been measured and results are reported. A broader group of potential applications is expected for non-membrane structures in micro-/nanosystems or their packaging. Possible approaches for those cases are discussed, considering comparison of measured deformation fields with either analytical solutions of the mechanical problem or with finite element simulations.

Paper Details

Date Published: 11 April 2007
PDF: 10 pages
Proc. SPIE 6528, Nanosensors, Microsensors, and Biosensors and Systems 2007, 65280Y (11 April 2007); doi: 10.1117/12.716291
Show Author Affiliations
Dietmar Vogel, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Neus Sabate, Centre Nacional de Microelectrònica, CNM-CSIC (Spain)
Astrid Gollhardt, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
Bernd Michel, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 6528:
Nanosensors, Microsensors, and Biosensors and Systems 2007
Vijay K. Varadan, Editor(s)

© SPIE. Terms of Use
Back to Top