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Proceedings Paper

The application of watershed segment method in the characterization of 3D motif
Author(s): Shenghuai Wang; Tiebang Xie
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Paper Abstract

Surface topography characterizing and assessing method in 3D is a research hot in surface metrology field. The 3D-Motif characterization method presented by F.Barre is an extension of 2D-Motif method. This 3D method is not practicable for the 3D grid sample data when the sample spacing is not small enough. For the limit of this characterization method, this article characterizes the 3D surface topography of 3D engineering surface with electron microscope image. The electron microscope images of fine processing workpiece surface topography with two kinds of machining methods are sampled. These images are gray images and denote the height of every point of the workpiece surface. To avoid the sample spacing limit of 3D surface topography with grid sample data, the watershed segment method is introduced to dispose the 3D surface topography images and used to segment those electron microscope images. Watershed segment method is a new image segment method, which is based on the topology theory of mathematic morphology. The basic idea of this method is to take the image as the topology relief of geodesy; the gray level of every pixel in the image denotes the elevation of the correlative point. Last, according to the parameters of 3D-Motif, this article characterizes the 3D surface topography of workpiece surface with two kinds of processing methods. The corresponding disposed images and final results are presented in this article and to provide a criterion for assessing the surface topography with different machining methods.

Paper Details

Date Published: 13 October 2006
PDF: 6 pages
Proc. SPIE 6280, Third International Symposium on Precision Mechanical Measurements, 62801Y (13 October 2006); doi: 10.1117/12.716173
Show Author Affiliations
Shenghuai Wang, Huazhong Univ. of Science and Technology (China)
Tiebang Xie, Huazhong Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 6280:
Third International Symposium on Precision Mechanical Measurements
Kuang-Chao Fan; Wei Gao; Xiaofen Yu; Wenhao Huang; Penghao Hu, Editor(s)

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