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Proceedings Paper

Electro-fluid-structural interaction simulation of a valveless micropump
Author(s): Guangzhe Li; Nam Seo Goo; Doyoung Byun
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Paper Abstract

In this paper, the pumping performance of a piezoelectric micropump is simulated with the commercial finite element analysis software COMSOL Multiphysics 3.2a. The micropump, which was developed in our previous work, is composed of a four-layer lightweight piezocomposite actuator, a polydimethylsiloxane (PDMS) pump chamber, and two diffusers. The piezoelectric domain, the structural domain and the fluid domain are coupled in the simulation. The water flow rates are numerically predicted for geometric parameters of the micropump. This study confirms that the micropump is optimally designed to obtain its maximum pumping performance.

Paper Details

Date Published: 11 April 2007
PDF: 8 pages
Proc. SPIE 6528, Nanosensors, Microsensors, and Biosensors and Systems 2007, 65280S (11 April 2007); doi: 10.1117/12.715876
Show Author Affiliations
Guangzhe Li, Konkuk Univ. (South Korea)
Nam Seo Goo, Konkuk Univ. (South Korea)
Doyoung Byun, Konkuk Univ. (South Korea)


Published in SPIE Proceedings Vol. 6528:
Nanosensors, Microsensors, and Biosensors and Systems 2007
Vijay K. Varadan, Editor(s)

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