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Proceedings Paper

Polymers for electrical connections in printed circuit boards
Author(s): Ryszard Kisiel
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Paper Abstract

It is becoming more and more difficult for the conventional PCBs with mechanically drilled vias and plated through holes to meet the current packaging density requirements. To overcome these challenges, new manufacturing schemes for high density and high performance multilayer PCBs have been developed. The polymer materials play important role in finding the cheap solution. Polymer materials are used to make reliable vertical interconnects in substrates made by SBU (Sequential build-up) processes. The SBU technology with conductive paste filled microvias can achieve a connection density of up to 100 pads/cm2 while the conventional PTHs can reach only 20 pads/cm2. The polymer base materials can be used to replace solders in PCB assembly. The exploitation data obtained from own research, and connected with applying adhesives in inner connections into PCB as well as connected with component assembly on PCB were given.

Paper Details

Date Published: 12 October 2006
PDF: 7 pages
Proc. SPIE 6347, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2006, 63471U (12 October 2006); doi: 10.1117/12.714551
Show Author Affiliations
Ryszard Kisiel, Warsaw Univ. of Technology (Poland)


Published in SPIE Proceedings Vol. 6347:
Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2006
Ryszard S. Romaniuk, Editor(s)

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