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Proceedings Paper

Process window and interlayer aware OPC for the 32-nm node
Author(s): Mark Terry; Gary Zhang; George Lu; Simon Chang; Tom Aton; Robert Soper; Mark Mason; Shane Best; Bill Dostalik; Stefan Hunsche; Jiang Wei Li; Rongchun Zhou; Mu Feng; Jim Burdorf
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Paper Abstract

Pushing optical microlithography towards the 32nm node requires hyper-NA immersion optics in combination with advanced illumination, polarization, and mask technologies. Novel approaches in model-based optical proximity correction (OPC) and sub-resolution assist feature (SRAF) optimization are required to not only produce correct feature shapes at the nominal process condition but also to maintain edge placement tolerances within spec limits under process variations in order to ensure a finite process window. In addition, it is becoming increasingly important to consider interactions between multiple layers when performing correction in order to ensure electrical viability. In this paper we discuss the application of a model based process-window-aware and interlayer-aware integrated OPC system on 32nm node patterns. Process window awareness will be demonstrated for main feature correction by taking into account image-based modeling at multiple defocus and dose conditions. In addition, interlayer-awareness will be demonstrated by correction that takes into account the effects of active width on gate CD and of contact overlap with metal, gate, and active. The results show an improvement over "non-aware" OPC in gate CD control, in contact overlap, and in overall process margin. In addition, PW aware correction is demonstrated to prevent potential catastrophic failures at extreme PW conditions.

Paper Details

Date Published: 27 March 2007
PDF: 11 pages
Proc. SPIE 6520, Optical Microlithography XX, 65200S (27 March 2007); doi: 10.1117/12.714442
Show Author Affiliations
Mark Terry, Texas Instruments Inc. (United States)
Gary Zhang, Texas Instruments Inc. (United States)
George Lu, Texas Instruments Inc. (United States)
Simon Chang, Texas Instruments Inc. (United States)
Tom Aton, Texas Instruments Inc. (United States)
Robert Soper, Texas Instruments Inc. (United States)
Mark Mason, Texas Instruments Inc. (United States)
Shane Best, Texas Instruments Inc. (United States)
Bill Dostalik, Texas Instruments Inc. (United States)
Stefan Hunsche, Brion Technologies (United States)
Jiang Wei Li, Brion Technologies (United States)
Rongchun Zhou, Brion Technologies (United States)
Mu Feng, Brion Technologies (United States)
Jim Burdorf, Brion Technologies (United States)

Published in SPIE Proceedings Vol. 6520:
Optical Microlithography XX
Donis G. Flagello, Editor(s)

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