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Proceedings Paper

Hybridization of active and passive elements for planar photonic components and interconnects
Author(s): M. Pearson; S. Bidnyk; A. Balakrishnan
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Paper Abstract

The deployment of Passive Optical Networks (PON) for Fiber-to-the-Home (FTTH) applications currently represents the fastest growing sector of the telecommunication industry. Traditionally, FTTH transceivers have been manufactured using commodity bulk optics subcomponents, such as thin film filters (TFFs), micro-optic collimating lenses, TO-packaged lasers, and photodetectors. Assembling these subcomponents into a single housing requires active alignment and labor-intensive techniques. Today, the majority of cost reducing strategies using bulk subcomponents has been implemented making future reductions in the price of manufacturing FTTH transceivers unlikely. Future success of large scale deployments of FTTH depends on further cost reductions of transceivers. Realizing the necessity of a radically new packaging approach for assembly of photonic components and interconnects, we designed a novel way of hybridizing active and passive elements into a planar lightwave circuit (PLC) platform. In our approach, all the filtering components were monolithically integrated into the chip using advancements in planar reflective gratings. Subsequently, active components were passively hybridized with the chip using fully-automated high-capacity flip-chip bonders. In this approach, the assembly of the transceiver package required no active alignment and was readily suitable for large-scale production. This paper describes the monolithic integration of filters and hybridization of active components in both silica-on-silicon and silicon-on-insulator PLCs.

Paper Details

Date Published: 9 February 2007
PDF: 7 pages
Proc. SPIE 6478, Photonics Packaging, Integration, and Interconnects VII, 64780L (9 February 2007); doi: 10.1117/12.714296
Show Author Affiliations
M. Pearson, Enablence Technologies, Inc. (Canada)
S. Bidnyk, Enablence Technologies, Inc. (Canada)
A. Balakrishnan, Enablence Technologies, Inc. (Canada)


Published in SPIE Proceedings Vol. 6478:
Photonics Packaging, Integration, and Interconnects VII
Allen M. Earman; Ray T. Chen, Editor(s)

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