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Paper Abstract

The conventional premise that metrology is a "non-value-added necessary evil" is a misleading and dangerous assertion, which must be viewed as obsolete thinking. Many metrology applications are key enablers to traditionally labeled "value-added" processing steps in lithography and etch, such that they can be considered integral parts of the processes. Various key trends in modern, state-of-the-art processing such as optical proximity correction (OPC), design for manufacturability (DFM), and advanced process control (APC) are based, at their hearts, on the assumption of fine-tuned metrology, in terms of uncertainty and accuracy. These trends are vehicles where metrology thus has large opportunities to create value through the engineering of tight and targetable process distributions. Such distributions make possible predictability in speed-sorts and in other parameters, which results in high-end product. Additionally, significant reliance has also been placed on defect metrology to predict, improve, and reduce yield variability. The necessary quality metrology is strongly influenced by not only the choice of equipment, but also the quality application of these tools in a production environment. The ultimate value added by metrology is a result of quality tools run by a quality metrology team using quality practices. This paper will explore the relationships among present and future trends and challenges in metrology, including equipment, key applications, and metrology deployment in the manufacturing flow. Of key importance are metrology personnel, with their expertise, practices, and metrics in achieving and maintaining the required level of metrology performance, including where precision, matching, and accuracy fit into these considerations. The value of metrology will be demonstrated to have shifted to "key enabler of large revenues," debunking the out-of-date premise that metrology is "non-value-added." Examples used will be from critical dimension (CD) metrology, overlay, films, and defect metrology.

Paper Details

Date Published: 5 April 2007
PDF: 21 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65181K (5 April 2007); doi: 10.1117/12.714216
Show Author Affiliations
Benjamin Bunday, International SEMATECH Manufacturing Initiative (United States)
Pete Lipscomb, International SEMATECH Manufacturing Initiative (United States)
John Allgair, International SEMATECH Manufacturing Initiative (United States)
Dilip Patel, International SEMATECH Manufacturing Initiative (United States)
Mark Caldwell, Freescale (United States)
Eric Solecky, IBM Microelectronics (United States)
Chas Archie, IBM Microelectronics (United States)
Jennifer Morningstar, IBM Microelectronics (United States)
Bryan J. Rice, SEMATECH (United States)
Bhanwar Singh, Advanced Micro Devices (United States)
Jason Cain, Advanced Micro Devices (United States)
Iraj Emami, Advanced Micro Devices (United States)
Bill Banke, IBM Microelectronics (United States)
Alfredo Herrera, Spansion (United States)
Vladamir Ukraintsev, Texas Instruments (United States)
Jerry Schlessinger, Texas Instruments (United States)
Jeff Ritchison, Texas Instruments (United States)

Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)

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