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Proceedings Paper

Initial experience establishing an EUV baseline lithography process for manufacturability assessment
Author(s): O. R. Wood; D. Back; R. Brainard; G. Denbeaux; D. Goldfarb; F. Goodwin; J. Hartley; K. Kimmel; C. Koay; B. La Fontaine; J. Mackey; B. Martinick; W. Montgomery; P. Naulleau; U. Okoroanyanwu; K. Petrillo; B. Pierson; M. Tittnich; S. Trogisch; T. Wallow; Y. Wei
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Paper Abstract

The International Venture for Nanolithography (INVENT) initiative announced in mid 2005, a unique industry-university consortium between the College of Nanoscale Science and Engineering at Albany and a group of leading edge integrated device manufacturers, has launched an extensive R&D program on EUV lithography (EUVL). The overall scope of the INVENT EUVL program, the status of our efforts to establish a baseline lithography process on a full-field EUVL scanner, and our progress in evaluating EUV resist materials, in designing a custom reticle for scanner characterization and in developing an actinic EUV mask imaging microscope, are discussed.

Paper Details

Date Published: 15 March 2007
PDF: 9 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65170U (15 March 2007); doi: 10.1117/12.714016
Show Author Affiliations
O. R. Wood, Advanced Micro Devices (United States)
D. Back, Qimonda North America (United States)
R. Brainard, Univ. at Albany (United States)
G. Denbeaux, Univ. at Albany (United States)
D. Goldfarb, IBM T J Watson Research Ctr. (United States)
F. Goodwin, Qimonda North America (United States)
J. Hartley, Univ. at Albany (United States)
K. Kimmel, IBM Corp. (United States)
C. Koay, IBM Corp. (United States)
B. La Fontaine, Advanced Micro Devices (United States)
J. Mackey, Micron Technology (United States)
B. Martinick, Qimonda North America (United States)
W. Montgomery, Univ. at Albany (United States)
P. Naulleau, Univ. at Albany (United States)
U. Okoroanyanwu, Advanced Micro Devices (United States)
K. Petrillo, IBM Corp. (United States)
B. Pierson, ASML (United States)
M. Tittnich, Univ. at Albany (United States)
S. Trogisch, Qimonda Dresden GmbH (Germany)
T. Wallow, Advanced Micro Devices (United States)
Y. Wei, Qimonda North America (United States)


Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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