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Proceedings Paper

Nanoimprinting with SU-8 epoxy resists
Author(s): Donald W. Johnson; Harris Miller; Mike Kubenz; Freimut Reuther; Gabi Gruetzner
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Paper Abstract

This paper reports on the evaluation of XP SU-8 4000NPG for potential use in nanoimprint applications using hot UV imprint lithography. The use of this material is advantageous in that it can be imprinted, exposed and sufficiently cured all at the same temperature without any temperature cycling providing an isothermal process leading to short cycle times. Uncured XP SU-8 4000NPG has a Tg below 10ºC, yet its films are sufficiently robust to be handled at temperatures from 40 to 70ºC. This resist exhibits excellent flow properties in this temperature range, which is also a range where the post exposure bake of the exposed areas is sufficient to lock in the imprinted patterns and allow easy stamp removal. Wafers can be spin coated with the 4000NPG to provide films of less than 100nm thickness to more than 500 nm and subsequently baked to remove the residual coating solvent. Precoated wafers are introduced into the imprint tool and placed on a pre-heated chuck for a few seconds to reach the set temperature, and then the imprint stamp is applied under pressure for 30-60 sec to allow adequate time to properly fill the mold. While still in the mold, the resist is exposed through the transparent stamp and simultaneously cured for as little as 10 sec in order to remove the stamp without tearing or pattern deformation. The wafer can then be immediately removed from the imprint tool. The optimal temperature is a balance between resist flow, cure rate and the thermal stresses imparted into the cured film at the higher operating temperatures.

Paper Details

Date Published: 22 March 2007
PDF: 8 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65172A (22 March 2007); doi: 10.1117/12.713710
Show Author Affiliations
Donald W. Johnson, MicroChem Corp. (United States)
Harris Miller, MicroChem Corp. (United States)
Mike Kubenz, micro resist technology GmbH (Germany)
Freimut Reuther, micro resist technology GmbH (Germany)
Gabi Gruetzner, micro resist technology GmbH (Germany)

Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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