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Proceedings Paper

Immersion-induced defect SEM-based library for fast baseline improvement and excursion
Author(s): Ilan Englard; Raf Stegen; Erik Van Brederode; Peter Vanoppen; Ingrid Minnaert-Janssen; Frank Duray; Ted der Kinderen; Gazi Tanriseven; Inge Lamers; Mireia Blanco Mantecon; Lior Levin; Eitan Binyamini; Nurit Raccah; Shalev Dror; Eran Valfer; Ofer Rotlevi; Robert Schreutelkamp; Rich Piech
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Paper Abstract

Immersion lithography offers great benefit for advanced technology nodes but at the same time poses a great challenge. Along with hyper NA values, which increase the scanner resolution, new types of imaging process related defects emerge. These new defects are related to water, top coating, resist and BARC in the litho process. Root cause analysis of the so-called wet defects (immersion) versus the so-called dry defects (non immersion-related) becomes crucial in any immersion lithography related defect reduction program. Manual and eventually automated classification of defects can be used to analyze the data and monitor baselines. Furthermore, a robust Automatic Defect Classification (ADC) increases productivity and decreases the wafer cycle time. This article outlines a methodological approach for wet and dry defect classification that employs rule-based ADC and enables the generation of an immersion induced defect library for fast baseline improvement and excursion monitoring. The work described in this article has been performed at ASML using Applied Materials' SEMVision G3 FIB automated defect review and analysis tool.

Paper Details

Date Published: 5 April 2007
PDF: 9 pages
Proc. SPIE 6518, Metrology, Inspection, and Process Control for Microlithography XXI, 65182G (5 April 2007); doi: 10.1117/12.713466
Show Author Affiliations
Ilan Englard, Applied Materials Europe (Netherlands)
Raf Stegen, ASML Netherlands B.V. (Netherlands)
Erik Van Brederode, ASML Netherlands B.V. (Netherlands)
Peter Vanoppen, ASML Netherlands B.V. (Netherlands)
Ingrid Minnaert-Janssen, ASML Netherlands B.V. (Netherlands)
Frank Duray, ASML Netherlands B.V. (Netherlands)
Ted der Kinderen, ASML Netherlands B.V. (Netherlands)
Gazi Tanriseven, ASML Netherlands B.V. (Netherlands)
Inge Lamers, ASML Netherlands B.V. (Netherlands)
Mireia Blanco Mantecon, ASML Netherlands B.V. (Netherlands)
Lior Levin, Applied Materials Europe (Israel)
Eitan Binyamini, Applied Materials Europe (Israel)
Nurit Raccah, Applied Materials Europe (Israel)
Shalev Dror, Applied Materials Europe (Israel)
Eran Valfer, Applied Materials Europe (Israel)
Ofer Rotlevi, Applied Materials Europe (Israel)
Robert Schreutelkamp, Applied Materials Europe (France)
Rich Piech, Applied Materials Europe (France)


Published in SPIE Proceedings Vol. 6518:
Metrology, Inspection, and Process Control for Microlithography XXI
Chas N. Archie, Editor(s)

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