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Proceedings Paper

Second-generation radiation sensitive developable bottom anti-reflective coatings (DBARC) and implant resists approaches for 193-nm lithography
Author(s): Francis Houlihan; Alberto Dioses; Medhat Toukhy; Andrew Romano; Joseph Oberlander; HengPeng Wu; Salem Mullen; Alexandra Krawicz; PingHung Lu; Mark Neisser
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Paper Abstract

We will discuss our approach towards a second generation radiation sensitive developable bottom antireflective coating (DBARC's) for 193 nm. We will show imaging results (1:1 L/S features down to 140 nm) for some first generation implant resist material based upon a fluorinated resins and also show relative implant resistance of these first generation fluorinated resists towards As implantation (15 KeV at 5x1015 dose with 20 x 10-4 amp). Also, discussed will be a second generation of implant resists based on a non-fluorinated resins. Surprisingly, we found that the nonfluorinated materials gave better implant resistance (~2-3 X1011 atoms/cm2) despite the higher atomic number of fluorine compared to hydrogen in the fluorinated implant materials (~2-5X1012 atoms/cm2). Finally, we will give an update on the lithographic performance of this second generation of implant resists.

Paper Details

Date Published: 2 April 2007
PDF: 8 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65190L (2 April 2007); doi: 10.1117/12.713436
Show Author Affiliations
Francis Houlihan, AZ Electronic Materials USA Corp. (United States)
Alberto Dioses, AZ Electronic Materials USA Corp. (United States)
Medhat Toukhy, AZ Electronic Materials USA Corp. (United States)
Andrew Romano, AZ Electronic Materials USA Corp. (United States)
Joseph Oberlander, AZ Electronic Materials USA Corp. (United States)
HengPeng Wu, AZ Electronic Materials USA Corp. (United States)
Salem Mullen, AZ Electronic Materials USA Corp. (United States)
Alexandra Krawicz, AZ Electronic Materials USA Corp. (United States)
PingHung Lu, AZ Electronic Materials USA Corp. (United States)
Mark Neisser, AZ Electronic Materials USA Corp. (United States)


Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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