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Proceedings Paper

A novel plasma-assisted shrink process to enlarge process windows of narrow trenches and contacts for 45-nm node applications and beyond
Author(s): Maaike Op de Beeck; Janko Versluijs; Zsolt Tőkei; Steven Demuynck; J.-F. De Marneffe; Werner Boullart; Serge Vanhaelemeersch; Helen Zhu; Peter Cirigliano; Elizabeth Pavel; Reza Sadjadi; Jisoo Kim
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Paper Abstract

Limits to the lithography process window restrict the scaling of critical IC features such as holes (contact, via) and trenches (required for interconnects and double patterning applications). To overcome this problem, contacts or trenches can be oversized during the exposure, followed by the application of a shrink technique. In this work, a novel shrink process utilizing plasma-assisted polymer deposition is demonstrated: a polymer is deposited on the top and sidewalls of photoresist by alternating deposition and etch steps, reducing the dimension of the lithography pattern in a controlled way. Hence very small patterns can be defined with wide process latitudes. This approach is generic and has been applied to both contacts and trenches. The feasibility of the plasma-assisted shrink technique was evaluated through extensive SEM inspections after lithography, after shrink, and after etch, as well as through electrical evaluations.

Paper Details

Date Published: 21 March 2007
PDF: 9 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65190U (21 March 2007); doi: 10.1117/12.713401
Show Author Affiliations
Maaike Op de Beeck, IMEC (Belgium)
Janko Versluijs, IMEC (Belgium)
Zsolt Tőkei, IMEC (Belgium)
Steven Demuynck, IMEC (Belgium)
J.-F. De Marneffe, IMEC (Belgium)
Werner Boullart, IMEC (Belgium)
Serge Vanhaelemeersch, IMEC (Belgium)
Helen Zhu, Lam Research Corp. (United States)
Peter Cirigliano, Lam Research Corp. (United States)
Elizabeth Pavel, Lam Research Corp. (United States)
Reza Sadjadi, Lam Research Corp. (United States)
Jisoo Kim, Lam Research Corp. (United States)

Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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