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Proceedings Paper

Status and path to a final EUVL reticle-handling solution
Author(s): Long He; Kevin Orvek; Phil Seidel; Stefan Wurm; Jon Underwood; Ernie Betancourt
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Paper Abstract

In extreme ultraviolet lithography (EUVL), the lack of a suitable material to build conventional pellicles calls for industry standardization of new techniques for protection and handling throughout the reticle's lifetime. This includes reticle shipping, robotic handling, in-fab transport, storage, and uses in atmospheric environments for metrology and vacuum environments for EUV exposure. In this paper, we review the status of the industry-wide progress in developing EUVL reticle-handling solutions. We show the industry's leading reticle carrier approaches for particle-free protection, such as improvements in conventional single carrier designs and new EUVL-specific carrier concepts, including variations on a removable pellicle. Our test indicates dual pod approach of the removable pellicle led to nearly particle-free use during a simulated life cycle, at ~50nm inspection sensitivity. We will provide an assessment of the remaining technical challenges facing EUVL reticle-handling technology. Finally, we will review the progress of the SEMI EUVL Reticle-handling Task Force in its efforts to standardize a final EUV reticle protection and handling solution.

Paper Details

Date Published: 15 March 2007
PDF: 10 pages
Proc. SPIE 6517, Emerging Lithographic Technologies XI, 65171O (15 March 2007); doi: 10.1117/12.712872
Show Author Affiliations
Long He, SEMATECH North (United States)
Kevin Orvek, SEMATECH North (United States)
Phil Seidel, SEMATECH (United States)
Stefan Wurm, SEMATECH (United States)
Jon Underwood, SEMATECH North (United States)
Ernie Betancourt, SEMATECH North (United States)


Published in SPIE Proceedings Vol. 6517:
Emerging Lithographic Technologies XI
Michael J. Lercel, Editor(s)

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