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Proceedings Paper

Golden curve method for OPC signature stability control in high MEEF applications
Author(s): Katja Geidel; Torsten Franke; Stefan Roling; Peter Buck; Martin Sczyrba; Engelbert Mittermeier; Russell Cinque
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Paper Abstract

The super-sensitivity of wafer critical dimensions (CDs) to mask CDs at low k1, known as the Mask Error Enhancement Factor (MEEF) drives the need for increasingly tighter mask CD control. In addition, the accuracy of the model based optical proximity correction (OPC) used to compensate systematic lithographic errors is partially dependent on a stable mask CD error signature that expands mask CD control requirements over multiple feature types. This paper presents the need for improved quantification and monitoring of mask CD signatures that includes CD characteristics relevant to OPC model calibration. It also introduces and discusses a new method to characterize, quantify, and control mask signatures in a mask manufacturing environment to limit the impact of mask CD variations on the OPC model validity. Multiple approaches to implementing this "golden curve" method are discussed in terms of their advantages and disadvantages.

Paper Details

Date Published: 27 March 2007
PDF: 8 pages
Proc. SPIE 6520, Optical Microlithography XX, 652040 (27 March 2007); doi: 10.1117/12.712867
Show Author Affiliations
Katja Geidel, Advanced Mask Technology Ctr. GmbH and Co. KG (Germany)
Torsten Franke, Qimonda AG (Germany)
Stefan Roling, AMD Fab 36 LLC and Co. KG (Germany)
Peter Buck, Toppan Photomasks, Inc. (United States)
Martin Sczyrba, Advanced Mask Technology Ctr. GmbH and Co. KG (Germany)
Engelbert Mittermeier, Qimonda AG (Germany)
Russell Cinque, Advanced Mask Technology Ctr. GmbH and Co. KG (Germany)

Published in SPIE Proceedings Vol. 6520:
Optical Microlithography XX
Donis G. Flagello, Editor(s)

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