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Proceedings Paper

A novel 248-nm wet-developable BARC for trench applications
Author(s): Charles J. Neef; Debra Thomas
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Paper Abstract

A novel polyamic acid-based, 248-nm wet-developable BARC has been prepared to improve structure clear-out and lessen post-development residue. This material showed an excellent process window and controllable development rates that can be achieved by simply changing the formulation. It is a highly absorbing BARC with n and k values equal to 1.73 and 0.49, respectively. Lithography with this material has shown 180-nm dense profiles with P338 and M230Y. These profiles exhibited minimal undercutting with good clearing between the lines. Clear-out has been demonstrated for 120-nm trenches. Post-development residue of the material was tested at various temperatures and was determined to be 6 Å or less. In addition, sublimation was evaluated.

Paper Details

Date Published: 30 March 2007
PDF: 8 pages
Proc. SPIE 6519, Advances in Resist Materials and Processing Technology XXIV, 65192Z (30 March 2007); doi: 10.1117/12.712459
Show Author Affiliations
Charles J. Neef, Brewer Science, Inc. (United States)
Debra Thomas, Brewer Science, Inc. (United States)


Published in SPIE Proceedings Vol. 6519:
Advances in Resist Materials and Processing Technology XXIV
Qinghuang Lin, Editor(s)

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